Skip to main content
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The full text of this article is not currently available.
1. R. S. Gilmore, J. Phys. D: Appl.Phys. 29, 1389 (1996).
2. A. Atalar, J. Appl. Phys. 49, 5130 (1978).
3. K. L. Telschow, V. A. Deason, D. L. Cottle, and J. D. Larson III, IEEE Trans. 50, 1279 (2003).
4. J. E. E. Baglin, Material Sci. and Eng. B1, 17 (1988).
5. S. D. Penn, P. H. Sneddon, H. Armandula, J. C. Betzwieser, G. Cagnoli, J. Camp, D. R. M. Crooks, M. M. Fejer, A. M. Gretarsson, G. M. Harry, J. Hough, S. E. Kittelberger, M. J. Mortonson, R. Route, S. Rowan, and C. C. Vassiliou, Class. Quantum Grav. 20, 2917 (2003).

Data & Media loading...


Article metrics loading...



An opto-acoustic technique is proposed to evaluate the adhesion strength of thin film systems at the film-substrate interface. The thin-film system to be examined is configured as an end-mirror of a Michelson interferometer, and driven from the rear with an acoustic transducer at audible frequencies. The amplitude of the resultant oscillation of the film is quantified as the variation in the contrast of the interferometric fringe pattern observed with a digital camera at 30 frames/s. As a proof of concept, experiment has been conducted with the use of a pair of strongly and weakly adhered Au-coated Si-wafer specimens. The technique successfully differentiates the adhesion strength of the specimens.


Full text loading...


Access Key

  • FFree Content
  • OAOpen Access Content
  • SSubscribed Content
  • TFree Trial Content
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd