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Low-pressure plasma-etching of bulk polymer materials using gas mixture of CF4 and O2
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/content/aip/journal/adva/3/11/10.1063/1.4830277
2013-11-07
2014-08-31

Abstract

In this study, we have proposed a low-pressure reactive ion etching of bulk polymer materials with a gas mixture of CF and O, and have achieved precise fabrication of poly(methyl methacrylate) (PMMA) and perfluoroalkoxy (PFA) bulk polymer plates with high-aspect-ratio and narrow gap array structures, such as, pillar, frustum, or cone, on a nano/micro scale. The effects of the etching conditions on the shape and size of each pillar were evaluated by changing etching duration and the size/material of etching mask. The fabricated PMMA array structures indicate possibilities of optical waveguide and nanofiber array. PFA cone array structures showed super-hydrophobicity without any chemical treatments. Also, polystyrene-coated silica spheres were used as an etching mask for the pillar array structure formation to control the gap between pillars.

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Scitation: Low-pressure plasma-etching of bulk polymer materials using gas mixture of CF4 and O2
http://aip.metastore.ingenta.com/content/aip/journal/adva/3/11/10.1063/1.4830277
10.1063/1.4830277
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