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Fabrication of silicon nanotip arrays with high aspect ratio by cesium chloride self-assembly and dry etching
2. Y. Tao, R. J. Fasching, and F. B. Prinz, Smart Structures and Materials 431 (2004).
5. A. Goryu et al., IEEE 23rd International Conference 280 (2010).
12. M. Q. Li and C. K. Ober, Mater Today 9, 9 (2006).
14. C. D. W. Wilkinson and M. Rahman, Philosophical Transactions of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences 362, 125 (2004).
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Nanotip arrays with high aspect ratio, which have attracted much attention due to their potential applications, have been fabricated by many methods. Dry etching combined with self-assembly masks is widely used because of the convenience of dry etching and high throughput of self-assembly. In this paper, we report a method combining Cesium Chloride (CsCl) self-assembly with inductively coupled plasma (ICP) dry etching to fabricate silicon nanotip arrays with high aspect ratio and silicon nanotip arrays with aspect ratio 15 have been achieved after optimization of all parameters.
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