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Enhanced cooling in mono-crystalline ultra-thin silicon by embedded
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In today’s digital world, complementary metal oxide semiconductor (CMOS) technology
enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted
in their higher performance but with increased dynamic and off-state power consumption. Such
trade-off has caused excessive heat generation which eventually drains the charge of
battery in portable devices. The traditional solution utilizing off-chip fans and
heat sinks used for heat management make the whole system bulky and less mobile. Here
we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline
(detached from bulk substrate) by utilizing deterministic pattern of porous network
of vertical “through silicon” micro-air channels that offer remarkable heat and
weight management for ultra-mobile electronics, in a cost effective way with 20×
reduction in substrate weight and a 12% lower maximum temperature at sustained
loads. We also show the effectiveness of this event in functional MOS field effect
transistors (MOSFETs) with high-κ/metal gate stacks.
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