Skip to main content

News about Scitation

In December 2016 Scitation will launch with a new design, enhanced navigation and a much improved user experience.

To ensure a smooth transition, from today, we are temporarily stopping new account registration and single article purchases. If you already have an account you can continue to use the site as normal.

For help or more information please visit our FAQs.

banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The full text of this article is not currently available.
/content/aip/journal/adva/5/4/10.1063/1.4904061
1.
1.L. Jay Guo, Adv. Mater. 19, 495513 (2007).
http://dx.doi.org/10.1002/adma.200600882
2.
2.D. Lepage, A. Jiménez, J. Beauvais, and J. J. Dubowski, Light: science & applications 2, e62, 18 (2013).
3.
3.R. Ji, M. Hornung, M. Verschuuren, R. van de Laar, J. Eekelen, U. Plachetka, M. Moeller, and C. Moormann, Microelectronic Engineering 87, 963967 (2010).
http://dx.doi.org/10.1016/j.mee.2009.11.134
4.
4.M. A. Verschuuren, “Substrate conformal imprint lithography for nanophotonics,” PhD thesis (Utrecht University, 2010).
5.
5.R. Fader, H. Schmitt, M. Rommel, A. Bauer, L. Frey, R. Ji, M. Hornung, M. Brehm, and M. Vogler, Microelectronic Engineering 98, 238241 (2012).
http://dx.doi.org/10.1016/j.mee.2012.07.010
6.
6.H. Schmitt, P. Duempelmann, R. Fader, M. Rommel, A. Bauer, L. Frey, M. Brehm, and A. Kraft, Microelectronic Engineering 98, 275278 (2012).
http://dx.doi.org/10.1016/j.mee.2012.04.032
http://aip.metastore.ingenta.com/content/aip/journal/adva/5/4/10.1063/1.4904061
Loading
/content/aip/journal/adva/5/4/10.1063/1.4904061
Loading

Data & Media loading...

Loading

Article metrics loading...

/content/aip/journal/adva/5/4/10.1063/1.4904061
2014-12-09
2016-12-04

Abstract

The UV-SCIL fabrication process was developed and optimized to improve the quality of the nanostructures on the hard substrate transferred with substrate conformal imprint lithography (SCIL) technology. In particular, the key steps such as coating imprint resist, exposure time and etching time were investigated thoroughly. The experiment’s results illustrate that imprint resist could well serve as an etching mask for the dry etching process without oxygen plasma. The optimized etching condition and SCIL technology could also be used to transfer nanostructures on different substrates for metal nanostructured biosensors or nanophotonics.

Loading

Full text loading...

/deliver/fulltext/aip/journal/adva/5/4/1.4904061.html;jsessionid=rfbcV1WiGu8C3J9XQVfS9Kdv.x-aip-live-02?itemId=/content/aip/journal/adva/5/4/10.1063/1.4904061&mimeType=html&fmt=ahah&containerItemId=content/aip/journal/adva
true
true

Access Key

  • FFree Content
  • OAOpen Access Content
  • SSubscribed Content
  • TFree Trial Content
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
/content/realmedia?fmt=ahah&adPositionList=
&advertTargetUrl=//oascentral.aip.org/RealMedia/ads/&sitePageValue=aipadvances.aip.org/5/4/10.1063/1.4904061&pageURL=http://scitation.aip.org/content/aip/journal/adva/5/4/10.1063/1.4904061'
Right1,Right2,Right3,