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/content/aip/journal/adva/5/4/10.1063/1.4905779
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http://aip.metastore.ingenta.com/content/aip/journal/adva/5/4/10.1063/1.4905779
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/content/aip/journal/adva/5/4/10.1063/1.4905779
2015-01-08
2016-09-29

Abstract

In order to improve the temperature stability of DC-contact RF MEMS switch, a thermal buckle-beam structure is implemented. The stability of the switch pull-in voltage versus temperature is not only improved, but also the impact of stress and stress gradient on the drive voltage is suppressed. Test results show that the switch pull-in voltage is less sensitive to temperature between -20 °C and 100 °C. The variable rate of pull-in voltage to temperature is about -120 mV/°C. The RF performance of the switch is stable, and the isolation is almost independent of temperature. After being annealed at 280 °C for 12 hours, our switch samples, which are suitable for packaging, have less than 1.5% change in the rate of pull-in voltage.

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