Skip to main content
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The full text of this article is not currently available.
1.U M Attia, S Marson, and J R Alcock, “Micro-injection moulding of polymer microfluidic devices [J],” Microfluidics and Nanofluidics 7(1), 1-28 (2009).
2.M J Wu, “Present State and Development of Diamond Cutting [J],” New Technology & New Process 1, 16-19 (2006).
3.D Wen, O Catherine, and L Kun, “Experiment design and UV-LIGA microfabrication technology to study the fracture toughness of Ni microstructures [J],” Microsystem Technologies 12(4), 306-314 (2006).
4.L Q Du, S P Mo, and Y S Zhang, “Fabrication of 3D metal microstructure based on UV-LIGA and micro-EDM technology [J],” Optics and Precision Engineering 18(2), 363-368 (2010).
5.L Q Du, J Qin, and H Liu, “Study on process of micro-injection metal mold based on UV-LIGA technology [J],” Micro Fabrication Technology 5, 51-54 (2006).
6.H Amir and X Y Zhang, “Polymer-based hybrid-integrated photonic devices for silicon on-chip modulation and board-level optical interconnects [J],” IEEE Journey of Selected Topics in Quantum Electronics 19(6), 3401115 (2013).
7.M Hamedi and M Vismeh, “Design, analysis and fabrication of silicon microfixture with electrothermal microclamp cell [J],” Microelectronic Engineering 111, 160-165 (2013).
8.M Elwenspoek and H Jansen, Silicon Micromachining [M] (Cambridge University Press, Cambridge, UK, 2004).
9.X Y Wang, X J Zhai, and T G Zhang, “Thermal stability of mechanical property and thermal expand coefficient of silicone chip [J],” Vacuum & Cryogenics 15(3), 156-159 (2009).
10.S Q Jiang, Y Q Tan, and C Li, “Study on mechanics properties and size effect of monocrystalle silicon using discrete element method [J],” China Mechanical Engineering 21(5), 589-594 (2010).
11.C H Wu and W S Chen, “Injection molding of grating optical elements with microfeatures [C],” Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II. 293-304 (2004).
12.J Werkmeister, M A Gosalvez, and P Willoughby, “Anisotropic etching of silicon as a tool for creating injection molding tooling surfaces [J],” Micro Electromechanical Systems 5(6), 1671-1680 (2006).
13.K F Zhang and Z Lu, “Analysis of morphology and performance of PP microstructures manufactured by micro injection molding [J],” Microsystem Technologies 14(2), 209-214 (2008).
14.L Xie, T Niese, Monika, and L Schadel, “A novel approach to realize the local precise variotherm process in micro injection molding [J],” Microsystem Technologies 19, 1017-1023 (2013).
15.D Holland and M Marder, “Ideal brittle fracture of silicon studied with molecular dynamics [J],” Physical Review Letters 80(4), 746-749 (1998).
16.M J Buehler, H Tang, and W A Goddard III, “Threshold crack speed controls dynamical fracture of silicon single crystals [J],” Physical Review Letters 99(16), (2007).
17.L L Mercado, H Wieser, and T Hauck, “Multichip package delamination and die fracture analysis [J],” IEEE Transactions on Advanced Packaging 26(2), 152-159 (2003).
18.A Masolin and P Q Bouchard, “Thermo-mechanical and fracture properties in single-crystal silicon [J],” Materials Science 48(3), 979-988 (2013).
19.W Cao, S F Gan, and S B Ye, “Study on air accumulation and influence on flow balance in micro-injection molding [J],” Manufacturing Science and Engineering 133(011004), 1-6 (2011).
20.K Y Jiang and H YOKOI, “Experiment study on filling imbalance phenomenon of melt front during injection molding process [J],” Mechanical Engineering 45(2), 294-300 (2009).

Data & Media loading...


Article metrics loading...



Silicon insert is a promising tool for microinjection moulding (MIM). However, its fracture problem induced by impact in MIM creates a bottleneck for application. The purpose of this paper is to investigate the impact behaviour in MIM and the effect on the fracture of silicon inserts. The finite element method is utilised to calculate the crack propagation of silicon inserts with pressure load and thermal load in the MIM process. The simulation result shows that the crack propagation is more easily induced by the increase of pressure load, while the temperature change has little effect on the crack propagation. An experimental platform, including a novel rotatable insert mould, is developed to investigate the dynamic pressure in the MIM process. The result shows that both the maximum pressure and the maximum loading rate occur in the initial period of MIM process. It indicates that the silicon insert is more prone to fracture at the beginning of the MIM process, and spatial pressure peaks are observed in the cavity as well. The nearly consistent distribution between the peak positions and the insert fracture zones shows that the pressure distribution is quite relevant to the fracture of the silicon insert. The result is helpful because it reveals the fracture phenomenon of silicon inserts.


Full text loading...


Access Key

  • FFree Content
  • OAOpen Access Content
  • SSubscribed Content
  • TFree Trial Content
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd