Skip to main content
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The full text of this article is not currently available.
1.SE Lyshevski, MEMS and NEMS: systems, devices, and structures (CRC Press, 2013).
2.T Magis, S Ballerand, AB Comte et al., “Deep silicon etch for biology MEMS fabrication: review of process parameters influence versus chip design,” SPIE MOEMS-MEMS. International Society for Optics and Photonics: 86120A-86120A-8 (2013).
3.S Chuang, C Pan, K Shen et al., “Thin film GaN LEDs using a patterned oxide sacrificial layer by chemical lift-off process” (2013).
4.W Tang, B Meng, W Su et al., “Investigation of silicon/glass anodic bonding with PECVD silicon carbide as the intermediate layer,” Journal of Micromechanics and Microengineering 22(9), 095011 (2012).
5.C M Liu, BCS Chou, RCF Tsai et al., “MEMS technology development and manufacturing in a CMOS foundry,” Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 16th International. IEEE, (2011), pp. 807–810.
6.J Korvink and O Paul, MEMS: A Practical Guide of Design, Analysis, and Applications (Springer, 2010).
7.MMR Howlader, MG Kibria, and F Zhang, “Hybrid plasma bonding of germanium and glass wafers at low temperature,” Materials Letters 64(13), 15321535 (2010).
8.ABA Dow, A Gougam, NP Kherani et al., “Single mask fabrication process for movable MEMS devices,” Microsystem Technologies 20(4/5), 955961 (2014).
9.K Lai, “Review of computational lithography modeling: focusing on extending optical lithography and design-technology co-optimization,” Advanced Optical Technologies 1(4), 249267 (2012).
10.Handbook of Sputter Deposition Technology: Fundamentals and Applications for Functional Thin Films, Nano-materials and MEMS (William Andrew, 2012).

Data & Media loading...


Article metrics loading...



It is found in our experiments that the depletion layer of anodic bonding is etched faster than the bulk glass (Pyrex 7740) in hydrofluoric acid (HF). Based on this interesting phenomenon, a novel process of a sacrificial layer is proposed in this paper. In order to deeply understand and investigate the rules concerning the influence of bonding parameters on this effect, firstly the width of the depletion layer under different bonding voltages and temperatures and the selection ratio of etching are revealed. To validate the feasibility of the method, a micro-machined accelerometer is designed and fabricated. The test results of resonant frequency and sensitivity of the fabricated accelerometer are 3254.5 Hz and 829.85–844.93 mV/g, respectively. This was further evidence that the depletion layer could be used as a sacrificial layer and the removable structure could be successfully released by fast etching this layer. The important feature of this method is that only one mask is needed in the whole process and therefore it could greatly simplify the fabrication process of the device.


Full text loading...


Access Key

  • FFree Content
  • OAOpen Access Content
  • SSubscribed Content
  • TFree Trial Content
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd