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N. Yazdi, F. Ayazi, and K. Najafi, Micromachined inertial sensors, Proc IEEE 86(8), 16401659 (1998).
P. Ripka and A. Tipek, Modern sensors handbook (Wiley, Wiltshire Samaun Wise KD, Angell JB, 1973), pp. 101109.
D. Tandeske, Pressure sensors: selection and application (Marcel Dekker, New York, 1991).
S. M. Shaby and A. V. Juliet, Design and analysis of MEMS pressure sensor by using ANSYS, In: Proceedings of the 2nd international conference on mechanical, automotive and materials engineering (MAME’12), Bali (Indonesia) (2012), pp. 132135.
M. Esashi, S. Sugiyama, K. Ikeda, Y. Wang, and H. Miyashita, “Vacuum-sealed silicon micromachined pressure sensors,” Proc IEEE 86(8), 16271639 (1998).
R. Singh, L. L. Ngo, H. S. Seng, and F. N. C. Mok, A silicon piezoresistive pressure sensor, In: Proceedings of the IEEE workshop on electronic design, test and applications, Christchurch, (2002), pp. 181184.
X. Liu, X. Lu, R. Chuai, R. Shi, and C. Suo, Polysilicon nanofilm pressure sensor, Sens Actuators A 154, 4245 (2009).
T. Bian, Z. Yulong, Z. Jiang, L. Zhang, N. Liao, Y. Lio, and C. Meng, The analysis and structural design of micro SOI pressure sensors. In: Proceedings of the 4th international conference on nano/micro eng. and molecular systems, Shenzhen, (2009), pp. 5558.
G. S. Chung, “Fabrication and characterization of a polycrystalline 3C-SiC piezoresistive micro-pressure Sensor,” J Korean Phys Soc 56(6), 17591762 (2010).
C. S. Park, B. S. Kang, D. W. Lee, T. Y. Choi, and Y. S. Choi, “Fabrication and characterization of a pressure sensor using a pitch-based carbon fibre,” Microelectron Eng 84, 13161319 (2007).
A. Bsoul, M. S. M. Ali, and K. Takahata, “Piezoresistive pressure sensor using vertically aligned carbon-nanotube forests,” Electron Lett 47(14), 807808 (2011).
L. Lou, S. Zhang, W. T. Park, J. M. Tsai, D. L. Kwong, and C. Lee, “Optimization of NEMS pressure sensors with multilayered diaphragm using silicon nanowires as piezoresistive sensing elements,” IEEE J Micromech Microeng 22(5), 055012-1-055012-15 (2012a).
A. Yamamoto and T. Tsutsumoto, “Piezoresistive effect of CVD polycrystalline diamond films,” Diam Relat Mater 13, 863866 (2004).
S. Chen, M. Q. Zhu, B. H. Ma, and W. Z. Yuan, Design and optimization of micro piezoresistive pressure sensor, In: Proceedings of the 3rd IEEE international conference on nano/micro engineered and molecular systems, (2008), pp. 351356.
H. H. Tsai, C. C. Hsieh, C. W. Fan, Y. C. Chen, and W. T. Wu, Design and characterization of temperature-robust piezoresistive micropressure sensor with double-wheatstone-bridge structure, In: Proceedings of the symposium on design, test, integration and packaging of MEMS/MOEMS, Rome, (2009), pp. 363368.
B. Folkmer, P. Steiner, and W. Lang, “Silicon nitride membrane sensors with monocrystalline transducers,” Sens Actuators A 54, 488492 (1996).
Y. H. Zhang, C. Yang, Z. H. Zhang, H. W. Lin, L. T. Liu, and T. L. Ren, “A novel pressure microsensor with 30-μm-thick diaphragm and meander-shaped piezoresistors partially distributed on highstress bulk silicon region,” IEEE Sens J 7(12), 17421748 (2007).
X. Li, Q. Liu, S. Pang, K. Xu, H. Tang, and C. Sun, “High-temperature piezoresistive pressure sensor based on implantation of oxygen into silicon wafer,” Sens Actuators A 179, 277282 (2012).
S. Chen, M. Q. Zhu, B. H. Ma, and W. Z. Yuan, Design and optimization of micro piezoresistive pressure sensor, In: Proceedings of the 3rd IEEE international conference on nano/micro engineered and molecular systems. (2008), pp. 351356.
W. P. Eaton and J. H. Smith, “Characterization of a surface micromachined pressure sensor array,” Proceedings of the SPIE 2642, 256264 (1995).
Z. H. Zhang, Y. H. Zhang, L. T. Liu, and T. L. Ren, A novel MEMS pressure sensor with MOSFET on chip, In: Proceedings of the IEEE sensors, (2008), pp. 15641567.
D. C. Abeysinghe, S. Dasgupta, J. T. Boyd, and H. E. Jackson, “A novel MEMS pressure sensor fabricated on an optical fiber,” IEEE Photonics Technol Lett 13(9), 993995 (2001).
B. Degani, D. Elata, and Y. Nemirovsky, “Micromirror device with reversibly adjustable properties,” Photonics Technology Letters 15(5) (2003).
W. H. Juan and S. W. Pang, ”High-aspect-ratio Si vertical micromirror arrays for optical switching,” J.MEMS. 7(2) (1998).
O. Wygant, M. Kupnik, and B. T. Khuri-Yakub, Ultrasonics Symposium, pp. 21112114, (2008).
S. P. Timoshenko and S. Woinowsky-Krieger, Theory of plates and shells, (1959).
S. Armbruster, F. Schafer, G. Lammel, H. Artmann, C. Schelling, H. Benzel, S. Finkbeiner, F. Larmer, P. Ruther, and O. Paul, A novel micromachining process for the fabrication of monocrystalline Si-membranes using porous silicon, In: Proceedings of 12th international conference on solid-state sensors, actuators, and microsystems, Boston, (2003), pp. 246249.
T. Toriyama and S. Sugiyama, “Analysis of piezoresistance in p-type silicon for mechanical sensors,” Journal of MEMS 11(5), 598604 (2002).
C. Liu, Foundation of MEMS (Electrical and computer Department University of Illionis at Urbana-Champaign Pearson Education International, 2006).

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In this paper, an analytical model of the composite membrane piezoresistive pressure sensor with the testing structure is established, which built the relationship between the electrostatic force and the material properties, dimension parameters of the sensor. By using the theoretical model of the sensor, it is easily to analyze the sensor’s performance, to optimize the dimension of the sensor, and to make the step of calibrating to be getting fast and accurate.


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