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(a) Direct CNT-Cu contact and polymer bonding. (b) The structure of HLK5 and its bonding to CNT.
(a) Normalized ACF of the temperature difference ΔT(t) for CNT-PEMA and CNT-HLK5. The integral of the ACF vs time is also plotted in the ordinate axis on the right hand side. (b) Possible bonding model between CNT and PEMA, HLK5 (sectional view). (c) Measured thermal resistances of the samples for PEMA bonding and HLK5 bonding as a function of the CNT lengths.
(a) The structure of HLK9. (b) Auger electron spectroscopy on washed CNTs and GaAs wafer. (c) The normalized vibrational density of states of CNT, PEMA, and HLK5.
Thermal resistances between CNT-polymer monomer from EMD simulations and the extracted resistances between CNT-polymer in TIM systems from experiments.
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