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Interfacial geometry in different stages of diffusion bonding of BMGs. (a) Surface geometry of specimens before diffusion bonding. (b) Sets of ridges touch peak to peak when the specimens are brought together in void formation stage. (c) Initial interface void geometry in void shrinkage stage.
Fraction of contact area as a function of bonding pressure after void formation stage (a constant temperature is used, T = 440 °C).
(a) Void shrinkage rate curves resulting from SDP, IDP, and PDP. (b) Void shrinkage time caused by SDP, IDP, PDP, and the total mechanisms. Aconstant temperature (T = 440 °C) and pressure (P = 120 MPa) are used in void shrinkage stage.
Schematic representation of the ion activated diffusion bonding furnace. The specimens were cleaned by argon ion beam etching in ion irradiation chamber, and then the specimens were sent into diffusion bonding chamber for diffusion bonding experiments without exposing them to atmosphere.
Theoretical shear strength of joints with different surface states before diffusion bonding according to the model, and test shear strength of joints with Ar ion beam etching surface treatment before diffusion bonding.
Results of all shear tests after conventional and surface treatment assisted diffusion bonding of BMG.
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