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Growth of continuous and ultrathin platinum films on tungsten adhesion layers using atomic layer deposition techniques
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10.1063/1.4749819
/content/aip/journal/apl/101/11/10.1063/1.4749819
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/11/10.1063/1.4749819
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Pt film thicknesses and density versus number of ALD cycles on W ALD adhesion layer using MeCpPtMe3 and H2 plasma as reactants at 120 °C: (a) First 200 ALD cycles; (b) All 1000 ALD cycles.

Image of FIG. 2.
FIG. 2.

Pt film thicknesses versus number of ALD cycles on W ALD adhesion layer using MeCpPtMe3 and H2 plasma as reactants at 120 °C. Pt film thicknesses were obtained from XPS data using the Thickogram model and from XRR data after adjusting for density.

Image of FIG. 3.
FIG. 3.

Relative XPS atomic fractions from Pt4d and W4f XPS signals versus density-adjusted Pt film thickness on W ALD adhesion layer. Dashed line shows prediction assuming a layer-by-layer growth mechanism for Pt ALD.

Image of FIG. 4.
FIG. 4.

XPS intensities of W4f signals for W metal and WO3 for various density-adjusted thicknesses of Pt ALD film on W ALD adhesion layer.

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/content/aip/journal/apl/101/11/10.1063/1.4749819
2012-09-11
2014-04-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Growth of continuous and ultrathin platinum films on tungsten adhesion layers using atomic layer deposition techniques
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/11/10.1063/1.4749819
10.1063/1.4749819
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