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FE simulation of the SE mode shape showing the T-shaped tethers flexing as the square-plate resonator vibrates, giving rise to anchor loss. Also shown are the relative thermal distribution contours associated with the relative stress gradients for the SE mode. Although a 3D model was used to simulate TED, a 2D topview is shown here instead for clearer visualization; (a) Plain resonator; (b) Resonator with distributed etch-holes. The pattern of the relative thermal distribution is similar to that of a plain design except whenever the etch holes disrupt the continuity of the thermal contours.
FE simulation model to quantify Qanchor in an SE mode resonator by incorporating a PML to absorb the outgoing elastic waves from the T-shaped tethers. “Max disp”: Maximum displacement; “Min disp”: Minimum displacement.
Optical micrograph of fabricated resonator with a circuit schematic of the bias configuration used in the electrical characterization of the device
Measured S21 electrical transmissions of a pair of SE mode resonators with and without etch-holes on the same die; Q is 75% lower in the latter device relative to the former.
Summary of device feature sizes and a comparison between measured and simulated Q.
Summary of the key parameters used in the FE simulation models.
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