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Manipulating spin injection into organic materials through interface engineering
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10.1063/1.4737008
/content/aip/journal/apl/101/2/10.1063/1.4737008
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/2/10.1063/1.4737008
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic energy level diagrams of (a) device A and (b) device B, respectively. The right side is the molecular structure of CuPc and Alq3.

Image of FIG. 2.
FIG. 2.

The I-V characteristic response of device A1 (black circle) and A2 (red open circle) and device B (black square) at 50 K.

Image of FIG. 3.
FIG. 3.

MR response of (a) device A1 and A2, with CuPc interlayer, and (b) device B, without CuPc interlayer, at a bias voltage of 100 mV at 50 K. (c) Normalized MR as a function of temperature for device A1 and device B at bias voltage of 100 mV (black circle) and 30 mV (red square), respectively.

Image of FIG. 4.
FIG. 4.

Normalized MR as a function of bias voltage for (a) device A and (b) device B, respectively, at 50 K.

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/content/aip/journal/apl/101/2/10.1063/1.4737008
2012-07-13
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Manipulating spin injection into organic materials through interface engineering
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/2/10.1063/1.4737008
10.1063/1.4737008
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