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Crack growth velocity vs. applied strain energy release rate curves at 50 °C and various humidity levels for (a) film A, (b) film B, (c) film C, and (d) film D. Kinetic fits based on Eq. (2) are shown as solid lines.
Gth plotted vs. RT*ln(RH) showing the linear behavior predicted by Eq. (6).
Gth normalized by the bond density extracted from the kinetic fits showing all data collapses to a single curve indicating no change in bond strength with varying dielectric constant. The inset shows the extracted bond density as a function of dielectric constant.
Details on the porosity and fits to the V-G curves for the dielectric films studied.
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