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Corrosion of Si-O based porous low-k dielectrics
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10.1063/1.4766336
/content/aip/journal/apl/101/20/10.1063/1.4766336
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/20/10.1063/1.4766336

Figures

Image of FIG. 1.
FIG. 1.

Crack growth velocity vs. applied strain energy release rate curves at 50 °C and various humidity levels for (a) film A, (b) film B, (c) film C, and (d) film D. Kinetic fits based on Eq. (2) are shown as solid lines.

Image of FIG. 2.
FIG. 2.

Gth plotted vs. RT*ln(RH) showing the linear behavior predicted by Eq. (6).

Image of FIG. 3.
FIG. 3.

Gth normalized by the bond density extracted from the kinetic fits showing all data collapses to a single curve indicating no change in bond strength with varying dielectric constant. The inset shows the extracted bond density as a function of dielectric constant.

Tables

Generic image for table
Table I.

Details on the porosity and fits to the V-G curves for the dielectric films studied.

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/content/aip/journal/apl/101/20/10.1063/1.4766336
2012-11-13
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Corrosion of Si-O based porous low-k dielectrics
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/20/10.1063/1.4766336
10.1063/1.4766336
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