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Cross-sectional TEM image of the initial TaN-capped Cu film geometry.
Evolution of in-plane stress measured in the TaN-capped Cu film during cooling and heating.
CTE values of Cu and Si and their difference as a function of temperature (data tabulated from Refs. 13 and 14).
Comparison of in-plane stress values of the SiCxNyHz-capped Cu film measured before and after LN2 immersion and in-situ during cryogenic cooling.
Fitted Cu (422) peak widths averaged over all ψ-tilts for the TaN-capped Cu film as a function of temperature.
Cross-sectional TEM image of the TaN-capped Cu film geometry after the cryogenic thermal excursion.
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