1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
oa
Plasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronics
Rent:
Rent this article for
Access full text Article
/content/aip/journal/apl/101/9/10.1063/1.4748322
1.
1. N. R. Peterson, D. B. Pisoni, and R. T. Miyamoto, Restor. Neurol. Neurosci. 28(2 ), 237 (2010).
2.
2. D. E. Weese-Mayer, A. S. Morrow, R. T. Brouillette, M. N. Ilbawi, and C. E. Hunt, Am. J. Respiratory Critical Care Med. 139(4 ), 974 (1989).
3.
3. G. Deuschl, C. Schade-Brittinger, P. Krack, J. Volkmann, H. Schäfer, K. Bötzel, C. Daniels, A. Deutschländer, U. Dillmann, and W. Eisner, New England J. Med. 355(9 ), 896 (2006).
http://dx.doi.org/10.1056/NEJMoa060281
4.
4. R. Biran, D. C. Martin, and P. A. Tresco, J. Biomed. Mater. Res. Part A 82(1 ), 169 (2007).
http://dx.doi.org/10.1002/jbm.a.31138
5.
5. P. de Vos, M. Bucko, P. Gemeiner, M. Navrátil, J. Svitel, M. Faas, B. L. Strand, and G. Skjak-Braek, Biomaterials 30(13 ), 2559 (2009).
http://dx.doi.org/10.1016/j.biomaterials.2009.01.014
6.
6. C. Hassler, R. P. von Metzen, P. Ruther, and T. Stieglitz, J. Biomed. Mater. Res. Part B: Appl. Biomater. 93(1 ), 266 (2010).
http://dx.doi.org/10.1002/jbm.b.31584
7.
7. J. M. Hsu, L. Rieth, R. A. Normann, P. Tathireddy, and F. Solzbacher, IEEE Trans. Biomed. Eng. 56(1 ), 23 (2009).
http://dx.doi.org/10.1109/TBME.2008.2002155
8.
8. J. P. Seymour, Y. M. Elkasabi, H. Y. Chen, J. Lahann, and D. R. Kipke, Biomaterials 30(31 ), 6158 (2009).
http://dx.doi.org/10.1016/j.biomaterials.2009.07.061
9.
9. J. B. Fortin and T. M. Lu, Chemical Vapor Deposition Polymerization: The Growth and Properties of Parylene Thin Films (Springer, 2004).
10.
10. M. Szwarc, Polym. Eng. Sci. 16(7 ), 473 (1976).
http://dx.doi.org/10.1002/pen.760160703
11.
11. W. Li, D. C. Rodger, P. R. Menon, and Y. C. Tai, ECS Trans. 11(18 ), 1 (2008).
http://dx.doi.org/10.1149/1.2897437
12.
12. A. P. Ghosh, L. J. Gerenser, C. M. Jarman, and J. E. Fornalik, Appl. Phys. Lett. 86, 223503 (2005).
http://dx.doi.org/10.1063/1.1929867
13.
13. E. Langereis, M. Creatore, S. B. S. Heil, M. C. M. Van de Sanden, and W. M. M. Kessels, Appl. Phys. Lett. 89(8 ), 081915 (2006).
http://dx.doi.org/10.1063/1.2338776
14.
14. T. T. A. Li and A. Cuevas, Prog. Photovoltaics: Res. Appl. 19(3 ), 320 (2011).
http://dx.doi.org/10.1002/pip.1031
15.
15. A. Abdulagatov, Y. Yan, J. Cooper, Y. Zhang, Z. Gibbs, A. S. Cavanagh, R. Yang, Y. Lee, and S. M. George, ACS Appl. Mater. Interfaces 3(12 ), 4593 (2011).
http://dx.doi.org/10.1021/am2009579
16.
16. S. Kim, R. Bhandari, M. Klein, S. Negi, L. Rieth, P. Tathireddy, M. Toepper, H. Oppermann, and F. Solzbacher, Biomed. Microdevices 11(2 ), 453 (2009).
http://dx.doi.org/10.1007/s10544-008-9251-y
17.
17. M. D. Groner, F. H. Fabreguette, J. W. Elam, and S. M. George, Chem. Mater. 16(4 ), 639 (2004).
http://dx.doi.org/10.1021/cm0304546
18.
18. G. Dingemans, R. Seguin, P. Engelhart, M. C. M. van de Sanden, and W. M. M. Kessels, Phys. Status Solidi (RRL)–Rapid Res. Lett. 4(1–2 ), 10 (2010).
http://dx.doi.org/10.1002/pssr.200903334
19.
19. K. H. Hwang, in ALD Conference, Monterey, CA, 14 May 2001.
20.
20. S. K. Kim, S. W. Lee, C. S. Hwang, Y. S. Min, J. Y. Won, and J. Jeong, J. Electrochem. Soc. 153, F69 (2006).
http://dx.doi.org/10.1149/1.2177047
21.
21. E. P. M. Van Westing, G. M. Ferrari, and J. H. W. De Wit, Electrochim. Acta 39(7 ), 899 (1994).
http://dx.doi.org/10.1016/0013-4686(94)85104-2
22.
22. E. Akbarinezhad and H. R. Faridi, Surface Eng. 24(4 ), 280 (2008).
http://dx.doi.org/10.1179/174329408X326524
23.
23. M. Uematsu and E. U. Franck, Static Dielectric Constant of Water and Steam (American Chemical Society and the American Institute of Physics for the National Bureau of Standards, 1981).
24.
24. K. J. Hemmerich, Med. Plastic Biomater. 5, 16 (1998).
25.
25. D. W. L. Hukins, A. Mahomed, and S. N. Kukureka, Med. Eng. Phys. 30(10 ), 1270 (2008).
http://dx.doi.org/10.1016/j.medengphy.2008.06.001
26.
26. J. M. Hsu, P. Tathireddy, L. Rieth, A. R. Normann, and F. Solzbacher, Thin Solid Films 516(1 ), 34 (2007).
http://dx.doi.org/10.1016/j.tsf.2007.04.050
27.
27. X. Z. Xie, L. Rieth, P. Tathireddy, and F. Solzbacher, Procedia Eng. 25, 483 (2011).
http://dx.doi.org/10.1016/j.proeng.2011.12.120
28.
28. J. J. Filliben, Engineering Statistics Handbook (National Institute of Standards and Technology, 2007), Chap. 8.
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/9/10.1063/1.4748322
Loading
/content/aip/journal/apl/101/9/10.1063/1.4748322
Loading

Data & Media loading...

Loading

Article metrics loading...

/content/aip/journal/apl/101/9/10.1063/1.4748322
2012-08-27
2014-09-03

Abstract

Encapsulation of biomedical implants with complex three dimensional geometries is one of the greatest challenges achieving long-term functionality and stability. This report presents an encapsulation scheme that combines Al2O3 by atomic layer deposition with parylene C for implantable electronic systems. The Al2O3-parylene C bi-layer was used to encapsulate interdigitated electrodes, which were tested invitro by soak testing in phosphate buffered saline solution at body temperature (37 °C) and elevated temperatures (57 °C and 67 °C) for accelerated lifetime testing up to 5 months. Leakage current and electrochemical impedance spectroscopy were measured for evaluating the integrity and insulation performance of the coating. Leakage current was stably about 15 pA at 5 V dc, and impedance was constantly about 3.5 MΩ at 1 kHz by using electrochemical impedance spectroscopy for samples under 67 °C about 5 months (approximately equivalent to 40 months at 37 °C). Alumina and parylene coating lasted at least 3 times longer than parylene coated samples tested at 80 °C. The excellent insulation performance of the encapsulation shows its potential usefulness for chronic implants.

Loading

Full text loading...

/deliver/fulltext/aip/journal/apl/101/9/1.4748322.html;jsessionid=1golonak25mvu.x-aip-live-03?itemId=/content/aip/journal/apl/101/9/10.1063/1.4748322&mimeType=html&fmt=ahah&containerItemId=content/aip/journal/apl
true
true
This is a required field
Please enter a valid email address
This feature is disabled while Scitation upgrades its access control system.
This feature is disabled while Scitation upgrades its access control system.
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Plasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronics
http://aip.metastore.ingenta.com/content/aip/journal/apl/101/9/10.1063/1.4748322
10.1063/1.4748322
SEARCH_EXPAND_ITEM