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Thermoelectric property enhancement by Cu nanoparticles in nanostructured FeSb2
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View: Figures


Image of FIG. 1.
FIG. 1.

Schematics of the band alignment between FeSb and Cu (a); distribution of Cu NPs in the nanocomposite (b), scale bar indicates that the grains of FeSb are around 50 nm on average and ∼5 nm for Cu NPs.

Image of FIG. 2.
FIG. 2.

TEM image (a) for FeSbCu nanocomposite prepared by mixing FeSb nanopowder and 100 nm Cu NPs; (b) EDS for the selected zones in (a); (c) HRTEM for zone C shown in (a), inset shows IFFT for (c); (d) TEM image for FeSbCu nanocomposite prepared by melting Fe, Sb, and Cu at 1350 K and solidifying; and (e) is the enlarged area in (d), inset is the IFFT of the Cu nanoparticle area in (d).

Image of FIG. 3.
FIG. 3.

Thermoelectric properties of FeSbCu (y = 0, 0.0225, 0.045, 0.09) samples: (a) temperature dependence of thermal conductivity, inset shows the measured thermal conductivity versus Cu content at 60 K; (b) temperature dependence of Seebeck coefficients; (c) temperature dependence of electrical resistivity, inset shows the peak Seebeck coefficient versus electrical conductivity at corresponding temperatures; (d) temperature dependence of power factor, inset shows the peak value of power factor at 60 K versus Cu content; and (e) temperature dependence of for FeSb and FeSbCu nanocomposites.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermoelectric property enhancement by Cu nanoparticles in nanostructured FeSb2