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(a) Results of measurements on fine grain electropolished cavities before and after mild baking; (b) individual for samples 1-EP and 3-EP-MB; (c) temperature mapping boards attached to the outside cavity walls; three boards are removed for demonstration purposes; (d) single individual board with sensor numbering; (e) schematic showing how angle is measured around the rotational cavity axis; 36 boards are uniformly spaced with 10° separation; (f) local magnetic field B at sensor locations and unfolded temperature maps of for unbaked and baked fine grain electropolished cavities at .
(a) S(E) for samples 6-BCP and 7-BCP-MB from the large grain BCP cavity, and fine grain cavity samples 4-BCP and 5-BCP-MB, which had additional BCP 50 μm after they were cut out; (b) S-W plot for the same samples.
S(E) for fine grain electropolished samples before (1-EP, 2-EP), and after (1-EP-MB, 2-EP-MB, 3-EP-MB) mild baking at 120 °C vacuum bake for 48 h. Inset shows the change in S(E) shape at low energies.
List of cutout samples investigated with VEPAS (EP, electropolishing; BCP, buffered chemical polishing; MB = mild baking − vacuum bake at 120 °C for 48 h).
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