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Structural stability of thermoelectric diffusion barriers: Experimental results and first principles calculations
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10.1063/1.4817511
/content/aip/journal/apl/103/5/10.1063/1.4817511
http://aip.metastore.ingenta.com/content/aip/journal/apl/103/5/10.1063/1.4817511
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) GIXRD spectra and (b) load-indentation depth and friction-time curves of Ni/(Bi,Sb)Te sample after 200 °C PDA. The interfacial shear stress inserted in Fig. 1(b) is an important parameter to evaluate adhesion energy at Ni/(Bi,Sb)Te interface.

Image of FIG. 2.
FIG. 2.

(a) Relaxed atomic structures and (b) total energies of Ni and Ta diffusion barriers in contact with Sb- and Te-terminated (Bi,Sb)Te.

Image of FIG. 3.
FIG. 3.

(a) Relaxed atomic structure of TaN diffusion barrier in contact with Sb- and Te-terminated (Bi,Sb)Te. (b) GIXRD spectra and (c) load-indentation depth and friction-time curves of TaN/(Bi,Sb)Te sample after 200 °C PDA. The interfacial shear stress inserted in Fig. 3(c) is an important parameter to evaluate adhesion energy at TaN/(Bi,Sb)Te interface.

Image of FIG. 4.
FIG. 4.

EDX depth profiles of (a) Cu/Ni/(Bi,Sb)Te, (b) Cu/Ta/(Bi,Sb)Te, and (c) Cu/TaN/(Bi,Sb)Te after 200 °C PDA.

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/content/aip/journal/apl/103/5/10.1063/1.4817511
2013-07-30
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Structural stability of thermoelectric diffusion barriers: Experimental results and first principles calculations
http://aip.metastore.ingenta.com/content/aip/journal/apl/103/5/10.1063/1.4817511
10.1063/1.4817511
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