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Superconducting NbN x C y thin films fabricated with a dual ion‐beam sputtering method
1.rf sputtering methods were utilized by: (a) T. L. Francavilla, S. A. Wolf, and E. F. Skelton, IEEE Trans. Magn. MAG‐17, 569 (1981);
1.(b) F. Shinoki, A. Shoji, S. Kosaka, S. Takada, and H. Hayakawa, Appl. Phys. Lett. 38, 285 (1981).
2.dc magnetron sputtering methods were utilized by: (a) D. D. Bacon, A. T. English, S. Nakahara, F. G. Peters, H. Schreiber, W. R. Sinclair, and R. B. van Dover, J. Appl. Phys. 54, 6509 (1983);
2.(b) M. Hikita, K. Takei, and M. Igarashi, J. Appl. Phys. 54, 7066 (1983);
2.(c) J. C. Villegier, L. Vieux‐Rochaz, M. Goniche, P. Renard, and M. Vabre, IEEE Trans. Magn. MAG‐21, 498 (1985);
2.(d) R. T. Kampwirth, D. W. Capone, H. K. E. Gray, and A. Vicens, IEEE Trans. Magn. MAG‐21, 459 (1985);
2.(e) S. Thakoor, J. L. Lamb, A. P. Thakoor, and S. K. Khanna, J. Appl. Phys. 58, 4643 (1985).
3.rf magnetron sputtering methods were utilized by: (a) E. J. Cukauskas, W. L. Carter, S. B. Qadri, and E. F. Skelton, IEEE Trans. Magn. MAG‐21, 505 (1985);
3.(b) E. J. Cukauskas, W. L. Carter, and S. B. Qadri, J. Appl. Phys. 57, 2538 (1985).
4.M. Gurvitch, J. P. Remeika, J. M. Rowell, J. Geerk, and W. P. Lowe, IEEE Trans. Magn. MAG‐21, 509 (1985).
5.J. R. Gavaler, J. Talvacchio, and A. I. Braginski, Adv. Cryo. Eng. 32, 627 (1986).
6.For previous uses of dual ion‐beam sputtering techniques see C. Weissmantel, Thin Solid Films 32, 11 (1976)
6.and J. M. E. Harper, J. J. Cuomo, and H. T. G. Hentzell, Appl. Phys. Lett. 43, 547 (1983).
7.L.‐J. Lin, E. K. Track, G.‐J. Cui, and D. E. Prober, Physica B 135, 220 (1985);
7.E. K. Track, L.‐J. Lin, G.‐J. Cui, and D. E. Prober, Adv. Cryo. Eng. 32, 635 (1986);
7.G.‐J. Cui, L.‐J. Lin, E. K. Track, and D. E. Prober, in Workshop on the Josephson Effect: Trends and Achievement, edited by A. Barone (World Scientific, Torino, Italy, to be published);
7. values up to 11.9 K have been obtained in subsequent work by E. K. Track with high‐energy ions (unpublished).
8.H. Jones, O. Fischer, and G. Bongi, Solid State Commun. 14, 1061 (1974);
8.R. W. Ralston, MIT Lincoln Lab., Internal Report ESD‐TR‐85‐317, 1985.
9.D. W. Face, S. T. Ruggiero, and D. E. Prober, J. Vac. Sci. Technol. A 1, 326 (1983).
10.Ion Tech Inc., Fort Collins, Colorado.
11.Commonwealth Scientific Corporation, Alexandria, Virginia.
12.R. W. Guard, J. W. Savage, and D. G. Swarthout, Trans. Metall. Soc. AIME 239, 643 (1967).
13.Electronic Space Products International, Westlake Village, California.
14.T. Yamashita, K. Hamasaki, Y. Kodaira, and T. Komata, IEEE Trans. Magn. MAG‐21, 932 (1985).
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