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Field‐assisted bonding below 200 °C using metal and glass thin‐film interlayers
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10.1063/1.98146
/content/aip/journal/apl/50/9/10.1063/1.98146
http://aip.metastore.ingenta.com/content/aip/journal/apl/50/9/10.1063/1.98146
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/content/aip/journal/apl/50/9/10.1063/1.98146
1987-03-02
2014-04-16
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Field‐assisted bonding below 200 °C using metal and glass thin‐film interlayers
http://aip.metastore.ingenta.com/content/aip/journal/apl/50/9/10.1063/1.98146
10.1063/1.98146
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