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New technique and analysis of accelerated electromigration life testing in multilevel metallizations
1.I. A. Blech, J. Appl. Phys. 47, 1203 (1976).
2.L. P. Muray and E. D. Wolf (unpublished).
3.C. V. Thompson and J. Cho, IEEE Electron Device Lett. EDL‐7, 667 (1986).
4.M. J. Attardo, R. Rutledge, and R. C. Jack, J. Appl. Phys. 42, 4343 (1971).
5.D. S. Gardner, J. D. Meindl, and K. C. Saraswat, IEEE Trans. Electron Devices ED‐34, 633 (1987).
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