1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The full text of this article is not currently available.
High‐conductance customized copper interconnections produced by laser seeding and selective electrodeposition
Rent:
Rent this article for
USD
10.1063/1.102875
/content/aip/journal/apl/56/25/10.1063/1.102875
http://aip.metastore.ingenta.com/content/aip/journal/apl/56/25/10.1063/1.102875
/content/aip/journal/apl/56/25/10.1063/1.102875
Loading

Data & Media loading...

Loading

Article metrics loading...

/content/aip/journal/apl/56/25/10.1063/1.102875
1990-06-18
2014-12-21
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: High‐conductance customized copper interconnections produced by laser seeding and selective electrodeposition
http://aip.metastore.ingenta.com/content/aip/journal/apl/56/25/10.1063/1.102875
10.1063/1.102875
SEARCH_EXPAND_ITEM