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Enhancement of deposition rates in the reactive sputtering of silicon exposed to an argon‐oxygen plasma
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10.1063/1.105449
/content/aip/journal/apl/59/4/10.1063/1.105449
http://aip.metastore.ingenta.com/content/aip/journal/apl/59/4/10.1063/1.105449
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/content/aip/journal/apl/59/4/10.1063/1.105449
1991-07-22
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Enhancement of deposition rates in the reactive sputtering of silicon exposed to an argon‐oxygen plasma
http://aip.metastore.ingenta.com/content/aip/journal/apl/59/4/10.1063/1.105449
10.1063/1.105449
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