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Planarization in multiple polyimide layers
1.J. K. Hagge, IEEE Trans. Components Hybrid Manuf. Technol. 12, 170 (1989).
2.P. L. Young, C. C. Chen, J. M. Cech, K. Li, and M. M. Oprysko, Frontiers in Electronic Materials and Processing, edited by L. J. Brillson (Plenum, New York, 1986), p. 267.
3.D. R. Day, D. Ridley, J. Mario, and S. D. Senturia, Polyimides 2; Synthesis, Characterization and Applications, edited by K. L. Mittal (Plenum, New York, 1984), p. 767.
4.L. B. Rothman, J. Electrochem. Soc. 127, 2216 (1980).
5.Probimide 400 series marketed by Ciba-Geigy, Inc.; see also Product Technical Bulletin Probimide 400 series, Ciba-Geigy, Inc., Hawthorn, NY.
6.DOP is defined as where is the initial step to be planarized and is the step height after application of the polyimide layer.
7.D.-Y. Shih, E. Galligan, J. Cataldo, J. Paraszczak, S. Nunes, R. Serino, W. Graham, and R. McGouey, J. Vac. Sci. Technol. B 8, 1038 (1990).
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