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Formation of TiN‐encapsulated copper structures in a NH3 ambient
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10.1063/1.106783
/content/aip/journal/apl/60/24/10.1063/1.106783
http://aip.metastore.ingenta.com/content/aip/journal/apl/60/24/10.1063/1.106783
/content/aip/journal/apl/60/24/10.1063/1.106783
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/content/aip/journal/apl/60/24/10.1063/1.106783
1992-06-15
2014-08-30
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Formation of TiN‐encapsulated copper structures in a NH3 ambient
http://aip.metastore.ingenta.com/content/aip/journal/apl/60/24/10.1063/1.106783
10.1063/1.106783
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