No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Thermal budget consideration in rapid isothermal processing
1.R. Singh, J. Appl. Phys. 63, R59 (1988).
2.R. Singh, in Proceedings of the International Conference on Beam Processing of Advanced Materials, edited by J. Singh and S. M. Copley (The Minerals, Metals, and Materials Society, Warrendale, PA, 1993), p. 619.
3.P. K. Catterjee and G. B. Larrabee, IEEE Trans. VLSI Systems 1, 7 (1993).
4.R. Singh, P. Chou, F. Radpour, A. J. Nelson, and H. S. Ullal, J. Appl. Phys. 66, 2381 (1989).
5.R. Singh, S. Sinha, R. P. S. Thakur, and P. Chou, Appl. Phys. Lett. 58, 1217 (1991).
6.R. P. S. Thakur, R. Singh, A. J. Nelson, H. S. Ullal, J. Chaudhari, and V. Gondhalekar, J. Appl. Phys. 66, 2381 (1989).
7.R. Singh, S. Sinha, R. P. S. Thakur, and H. J. Hsu, Mater. Res. Soc. 227, 67 (1991).
8.C. R. Peter, J. P. DeSouza, and C. M. Hasenack, J. Appl. Phys. 64, 2696 (1988).
9.M. M. Moslehi, IEEE Trans. Semicond. Manufact. 2, 130 (1989).
10.R. Subrahmanyan, M. Orlowski, and G. Huffman, in Technical Digest, International Electron Devices Meeting (IEEE, New York, 1990), p. 748.
11.K. Keyers, V. Lauer, and P. Balk, in Proceedings of the First International Rapid Thermal Processing Conference, edited by R. B. Fair and B. Lojek, (RTP, Scottsdale, AZ, 1993), p. 135.
12.G. K. Celler and T. E. Seidel, Silicon Integrated Circuits, Part C, edited by D. Khang (Academic, New York, 1985), p. 1.
13.R. B. Fair, Rapid Thermal Processing (Academic, New York, 1993), p. 1.
14.R. B. Fair, in Ref. 14, p. 169.
15.M. Heinrich, M. Budil, and H. W. Potzl, J. Appl. Phys. 69, 133 (1991).
Article metrics loading...
Full text loading...
Most read this month
Most cited this month