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Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
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10.1063/1.116013
/content/aip/journal/apl/68/16/10.1063/1.116013
http://aip.metastore.ingenta.com/content/aip/journal/apl/68/16/10.1063/1.116013
/content/aip/journal/apl/68/16/10.1063/1.116013
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/content/aip/journal/apl/68/16/10.1063/1.116013
1996-04-15
2014-12-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
http://aip.metastore.ingenta.com/content/aip/journal/apl/68/16/10.1063/1.116013
10.1063/1.116013
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