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Influence of W via on the mechanism of electromigration failure in Al–0.5 Cu interconnects
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10.1063/1.121467
/content/aip/journal/apl/72/22/10.1063/1.121467
http://aip.metastore.ingenta.com/content/aip/journal/apl/72/22/10.1063/1.121467
/content/aip/journal/apl/72/22/10.1063/1.121467
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/content/aip/journal/apl/72/22/10.1063/1.121467
1998-06-01
2014-07-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Influence of W via on the mechanism of electromigration failure in Al–0.5 Cu interconnects
http://aip.metastore.ingenta.com/content/aip/journal/apl/72/22/10.1063/1.121467
10.1063/1.121467
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