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Lateral etching and filling of high aspect ratio nanometer-size cavities for silicon device structures
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10.1063/1.122639
/content/aip/journal/apl/73/20/10.1063/1.122639
http://aip.metastore.ingenta.com/content/aip/journal/apl/73/20/10.1063/1.122639
/content/aip/journal/apl/73/20/10.1063/1.122639
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/content/aip/journal/apl/73/20/10.1063/1.122639
1998-11-16
2014-10-01
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Lateral etching and filling of high aspect ratio nanometer-size cavities for silicon device structures
http://aip.metastore.ingenta.com/content/aip/journal/apl/73/20/10.1063/1.122639
10.1063/1.122639
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