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Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
1.F. M. d’Heurle and R. Rosenberg, in Physics of Thin Films (Academic, New York, 1973), Vol, 7, p. 257.
2.P. S. Ho and T. Kwok, Rep. Prog. Phys. 52, 301 (1989).
3.C. K. Hu and J. M. E. Harper, Mater. Chem. Phys. 52, 5 (1998).
4.The National Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, 1997).
5.D. Gupta, K. Viergge, and W. Gust, Acta Mater. 47, 5 (1999).
6.K. N. Tu, Phys. Rev. B 49, 2030 (1994).
7.H. B. Huntington and A. R. Grone, J. Phys. Chem. Solids 20, 76 (1961).
8.K. N. Tu, J. W. Mayer, and L. C. Feldman, Electronic Thin Film Science (Macmillan, New York, 1992), Ch. 14.
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