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Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow
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10.1063/1.125412
/content/aip/journal/apl/75/23/10.1063/1.125412
http://aip.metastore.ingenta.com/content/aip/journal/apl/75/23/10.1063/1.125412
/content/aip/journal/apl/75/23/10.1063/1.125412
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/content/aip/journal/apl/75/23/10.1063/1.125412
1999-12-06
2014-09-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow
http://aip.metastore.ingenta.com/content/aip/journal/apl/75/23/10.1063/1.125412
10.1063/1.125412
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