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Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow
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9.Underfills are polymers used to fill the gap between the substrate and the chip, increasing the reliability of the solder joints. And no-flow underfill refers to underfill that can be applied on substrates before bonding, in contrast to the conventional ones that are added to the package after bonding.
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