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Crystallographic study of electromigration failure sites in submicron Al(Cu) interconnects
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10.1063/1.125457
/content/aip/journal/apl/75/24/10.1063/1.125457
http://aip.metastore.ingenta.com/content/aip/journal/apl/75/24/10.1063/1.125457
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/content/aip/journal/apl/75/24/10.1063/1.125457
1999-12-13
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Crystallographic study of electromigration failure sites in submicron Al(Cu) interconnects
http://aip.metastore.ingenta.com/content/aip/journal/apl/75/24/10.1063/1.125457
10.1063/1.125457
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