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Direct wafer bonding and transfer of 10-μm-thick magnetic garnet films onto semiconductor surfaces
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10.1063/1.126003
/content/aip/journal/apl/76/10/10.1063/1.126003
http://aip.metastore.ingenta.com/content/aip/journal/apl/76/10/10.1063/1.126003
/content/aip/journal/apl/76/10/10.1063/1.126003
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/content/aip/journal/apl/76/10/10.1063/1.126003
2000-03-06
2014-08-31
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Direct wafer bonding and transfer of 10-μm-thick magnetic garnet films onto semiconductor surfaces
http://aip.metastore.ingenta.com/content/aip/journal/apl/76/10/10.1063/1.126003
10.1063/1.126003
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