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Analysis of thermal stress in wafer bonding of dissimilar materials for the introduction of an InP-based light emitter into a GaAs-based three-dimensional photonic crystal
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10.1063/1.1576911
/content/aip/journal/apl/82/20/10.1063/1.1576911
http://aip.metastore.ingenta.com/content/aip/journal/apl/82/20/10.1063/1.1576911
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/content/aip/journal/apl/82/20/10.1063/1.1576911
2003-05-12
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Analysis of thermal stress in wafer bonding of dissimilar materials for the introduction of an InP-based light emitter into a GaAs-based three-dimensional photonic crystal
http://aip.metastore.ingenta.com/content/aip/journal/apl/82/20/10.1063/1.1576911
10.1063/1.1576911
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