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Atomic-layer-deposited thin films as diffusion barrier for copper metallization
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10.1063/1.1585111
/content/aip/journal/apl/82/25/10.1063/1.1585111
http://aip.metastore.ingenta.com/content/aip/journal/apl/82/25/10.1063/1.1585111
/content/aip/journal/apl/82/25/10.1063/1.1585111
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/content/aip/journal/apl/82/25/10.1063/1.1585111
2003-06-16
2014-08-22
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Atomic-layer-deposited WNxCy thin films as diffusion barrier for copper metallization
http://aip.metastore.ingenta.com/content/aip/journal/apl/82/25/10.1063/1.1585111
10.1063/1.1585111
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