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Wafer-bonded semiconductors using In/Sn and Cu/Ti metallic interlayers
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10.1063/1.1738933
/content/aip/journal/apl/84/18/10.1063/1.1738933
http://aip.metastore.ingenta.com/content/aip/journal/apl/84/18/10.1063/1.1738933
/content/aip/journal/apl/84/18/10.1063/1.1738933
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/content/aip/journal/apl/84/18/10.1063/1.1738933
2004-04-20
2014-12-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Wafer-bonded semiconductors using In/Sn and Cu/Ti metallic interlayers
http://aip.metastore.ingenta.com/content/aip/journal/apl/84/18/10.1063/1.1738933
10.1063/1.1738933
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