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Patterning conductive copper by nanotransfer printing
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10.1063/1.1803916
/content/aip/journal/apl/85/15/10.1063/1.1803916
http://aip.metastore.ingenta.com/content/aip/journal/apl/85/15/10.1063/1.1803916
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Figures

Image of FIG. 1.
FIG. 1.

(a) Schematic of copper pattern transfer by nTP. Copper is deposited onto a PDMS stamp by e-beam evaporation. The PDMS stamp is then contacted for at room temperature against a substrate that was pretreated with 1,8-octanedithiol. After removing the stamp, the copper patterns are bound to the substrate in the areas of contact. (b) Optical micrograph of a printed copper film revealing the large-area printing capability of nTP. Light regions correspond to copper, dark regions correspond to .

Image of FIG. 2.
FIG. 2.

(a) Copper LMM spectra of pure copper (II) oxide (bottom), a printed nonconductive copper pattern beneath the surface (middle), and pure copper (top). spectra of (b) gold and (c) copper printed with as-cast PDMS stamps, and (d) copper printed with a toluene-leached stamp. All spectra are offset for clarity. In graphs b through d, the top spectra were obtained on the printed surfaces, while the middle and the bottom spectra were obtained below the surface and at the metal/GaAs interface, respectively (note differences in -axis scale).

Image of FIG. 3.
FIG. 3.

Normalized integrated peak intensities of oxygen along the depth of the patterns. All peaks were also normalized by the appropriate atomic sensitivity factor. (See Ref. 20). The PDMS oligomers reside only on the surface of gold, but permeate through the copper patterns.

Image of FIG. 4.
FIG. 4.

Resistance measured along the length of printed continuous copper lines. The slope yields an average resistivity of . Top inset: Optical micrograph of one of the printed copper lines. Light regions correspond to copper.

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/content/aip/journal/apl/85/15/10.1063/1.1803916
2004-10-19
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Patterning conductive copper by nanotransfer printing
http://aip.metastore.ingenta.com/content/aip/journal/apl/85/15/10.1063/1.1803916
10.1063/1.1803916
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