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Typical curve. Also shown is a blowup of the subgap current.
Subgap current for several ’s. is changed by applying a magnetic field. The solid lines are fits using Eq. (2).
Subgap resistance vs for three junctions.
Measurements of the minimum subgap current vs for two critical currents.
Typical device parameters.
Fitting parameters used to obtain solid lines shown in Fig. 2.
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