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Finite size effects in stress analysis of interconnect structures
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10.1063/1.1776331
/content/aip/journal/apl/85/5/10.1063/1.1776331
http://aip.metastore.ingenta.com/content/aip/journal/apl/85/5/10.1063/1.1776331
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Typical sample geometry for the shear-lag model. For evaporated films, the interface region is not well-defined. One can define this region as the volume where neither the film nor the substrate symmetry operators are fully applicable.

Image of FIG. 2.
FIG. 2.

Average stress variation with temperature for the pattern and blanket regions of sample set 2. The dashed line indicates the stresses obtained from Eq. (3).

Image of FIG. 3.
FIG. 3.

(a) Variation of average retained thermal residual stress values at room temperature with annealing temperature for sample set 1. The stress values from the patterned region are equal to those determined from the blanket region. (b) Variation of average retained thermal residual stress values at room temperature with annealing temperature for sample set 2. The stress values from the patterned region are much lower from those determined from the blanket region.

Image of FIG. 4.
FIG. 4.

Variation of the local stress with position in 3 and features calculated from Eq. (1) using the interfacial stiffness ratio, , of the features after the maximum temperature anneal. The vertical lines define the feature boundaries.

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/content/aip/journal/apl/85/5/10.1063/1.1776331
2004-07-27
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Finite size effects in stress analysis of interconnect structures
http://aip.metastore.ingenta.com/content/aip/journal/apl/85/5/10.1063/1.1776331
10.1063/1.1776331
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