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Fabrication of atomic-scale gold junctions by electrochemical plating using a common medical liquid
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10.1063/1.1897444
/content/aip/journal/apl/86/14/10.1063/1.1897444
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/14/10.1063/1.1897444
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Scanning electron microscope images of a pair of gold electrodes with spacing patterned on a semi-insulating GaAs substrate (a). After electroplating gold, the spacing was reduced down to (b).

Image of FIG. 2.
FIG. 2.

Time evolution of the junction resistance during the electrochemical deposition in the gold-dissolved iodine tincture. The junction resistance is normalized by . The inset in the upper-right corner shows a schematic illustration of the setup for electroplating and in situ resistance monitoring. The insets along the data points are schematic illustrations of expected morphologies of the junction.

Image of FIG. 3.
FIG. 3.

Time evolution of the junction conductance during electroplating at a slower reaction speed. The plating bias voltage was reduced down to . The measured conductance is normalized by .

Image of FIG. 4.
FIG. 4.

Time evolution of the junction resistance in the dissolution mode of electroplating. When the junction broke, it exhibited a resistance jump up to . The insets are schematic illustrations of expected morphologies of the junction.

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/content/aip/journal/apl/86/14/10.1063/1.1897444
2005-03-28
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Fabrication of atomic-scale gold junctions by electrochemical plating using a common medical liquid
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/14/10.1063/1.1897444
10.1063/1.1897444
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