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Scanning electron microscope images of a pair of gold electrodes with spacing patterned on a semi-insulating GaAs substrate (a). After electroplating gold, the spacing was reduced down to (b).
Time evolution of the junction resistance during the electrochemical deposition in the gold-dissolved iodine tincture. The junction resistance is normalized by . The inset in the upper-right corner shows a schematic illustration of the setup for electroplating and in situ resistance monitoring. The insets along the data points are schematic illustrations of expected morphologies of the junction.
Time evolution of the junction conductance during electroplating at a slower reaction speed. The plating bias voltage was reduced down to . The measured conductance is normalized by .
Time evolution of the junction resistance in the dissolution mode of electroplating. When the junction broke, it exhibited a resistance jump up to . The insets are schematic illustrations of expected morphologies of the junction.
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