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Collapse of stamps for soft lithography due to interfacial adhesion
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10.1063/1.1900303
    K. J. Hsia1,a),b), Y. Huang2, E. Menard3,b),c), J.-U. Park3,b),c), W. Zhou4, J. Rogers5,b),c),d),e) and J. M. Fulton6
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    Affiliations:
    1 Department of Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    2 Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    3 Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    4 Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    5 Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    6 Department of Materials Science and Engineering, University of Wisconsin at Madison, Madison, Wisconsin 53706
    a) Author to whom correspondence should be addressed; electronic mail: kjhsia@uiuc.edu
    b) Also at: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
    c) Also at: Beckman Institute, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
    d) Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
    e) Electronic mail: jrogers@uiuc.edu
    Appl. Phys. Lett. 86, 154106 (2005); http://dx.doi.org/10.1063/1.1900303
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/content/aip/journal/apl/86/15/10.1063/1.1900303
2005-04-06
2014-09-02
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Collapse of stamps for soft lithography due to interfacial adhesion
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/15/10.1063/1.1900303
10.1063/1.1900303
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