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Collapse of stamps for soft lithography due to interfacial adhesion
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10.1063/1.1900303
    K. J. Hsia1,a),b), Y. Huang2, E. Menard3,b),c), J.-U. Park3,b),c), W. Zhou4, J. Rogers5,b),c),d),e) and J. M. Fulton6
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    Affiliations:
    1 Department of Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    2 Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    3 Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    4 Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    5 Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
    6 Department of Materials Science and Engineering, University of Wisconsin at Madison, Madison, Wisconsin 53706
    a) Author to whom correspondence should be addressed; electronic mail: kjhsia@uiuc.edu
    b) Also at: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
    c) Also at: Beckman Institute, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
    d) Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
    e) Electronic mail: jrogers@uiuc.edu
    Appl. Phys. Lett. 86, 154106 (2005); http://dx.doi.org/10.1063/1.1900303
/content/aip/journal/apl/86/15/10.1063/1.1900303
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/15/10.1063/1.1900303
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Schematics of the PDMS stamp specimens, and (b) details of a collapsed groove with a contact region .

Image of FIG. 2.
FIG. 2.

(Color) Optical micrograph of a typical collapsing front in a PDMS stamp, dimension: , , and . The white contours are the displacement profiles of the stamp surface at fully collapsed and uncollapsed locations.

Image of FIG. 3.
FIG. 3.

(Color) Experimental measurements (individual data points) and model predictions (solid lines) of the noncontact width of fully collapsed grooves as a function of groove height for a wide range of .

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/content/aip/journal/apl/86/15/10.1063/1.1900303
2005-04-06
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Collapse of stamps for soft lithography due to interfacial adhesion
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/15/10.1063/1.1900303
10.1063/1.1900303
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