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Nanoindentation tests on diamond-machined silicon wafers
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10.1063/1.1924895
/content/aip/journal/apl/86/18/10.1063/1.1924895
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/18/10.1063/1.1924895
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Typical load-displacement curves in nanoindentation tests of (a) pristine silicon wafers and (b) machined silicon wafers.

Image of FIG. 2.
FIG. 2.

Comparison of measured hardness between the pristine silicon wafer and the machined silicon wafer.

Image of FIG. 3.
FIG. 3.

Comparison of indentation depth ratio between the pristine silicon wafer and the machined silicon wafer.

Image of FIG. 4.
FIG. 4.

AFM topographies and cross-sectional profiles of indents generated on (a) pristine silicon wafer and (b) machined silicon wafer.

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/content/aip/journal/apl/86/18/10.1063/1.1924895
2005-04-29
2014-04-17
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Nanoindentation tests on diamond-machined silicon wafers
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/18/10.1063/1.1924895
10.1063/1.1924895
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