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Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
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10.1063/1.1925317
/content/aip/journal/apl/86/18/10.1063/1.1925317
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/18/10.1063/1.1925317
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Dissolved Cu foil thicknesses in pure Sn (엯), Sn-0.7Cu (▿), Sn-1.5Cu (□), and Sn-3.5Ag (Δ) molten solders at (a) 250, (b) 300, (c) 350, and (d) .

Image of FIG. 2.
FIG. 2.

Average thicknesses of interfacial IMC layers after various times in all of the molten solders at .

Image of FIG. 3.
FIG. 3.

Top view of interfacial grains after removing the various solders. (a) for , (b) for , and (c) for . For Sn-3.5Ag solder, arrows show tiny attaching to the grains.

Image of FIG. 4.
FIG. 4.

Average diameter of interfacial grains between Cu and all of the solders for at various temperatures.

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/content/aip/journal/apl/86/18/10.1063/1.1925317
2005-04-29
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
http://aip.metastore.ingenta.com/content/aip/journal/apl/86/18/10.1063/1.1925317
10.1063/1.1925317
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