Full text loading...
Dissolved Cu foil thicknesses in pure Sn (엯), Sn-0.7Cu (▿), Sn-1.5Cu (□), and Sn-3.5Ag (Δ) molten solders at (a) 250, (b) 300, (c) 350, and (d) .
Average thicknesses of interfacial IMC layers after various times in all of the molten solders at .
Top view of interfacial grains after removing the various solders. (a) for , (b) for , and (c) for . For Sn-3.5Ag solder, arrows show tiny attaching to the grains.
Average diameter of interfacial grains between Cu and all of the solders for at various temperatures.
Article metrics loading...