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Surface oxide reduction and bilayer molecular assembly of a thiol-terminated organosilane on Cu
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10.1063/1.1968414
/content/aip/journal/apl/87/1/10.1063/1.1968414
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/1/10.1063/1.1968414
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

High-resolution XPS spectra showing (a) Cu  states in as-deposited Cu (filled squares), MPTMS-treated Cu (filled circles) and a “clean” unoxidized Cu (open circles) surface obtained after 5 min of 5 keV etching of the as-deposited Cu surface; (b) S  states in MPTMS-treated Cu (filled circles), MPTMS SAM on (filled squares), and Cu fracture surface of (open circles) characterized by Cu–S bonding.

Image of FIG. 2.
FIG. 2.

(a) Cu  photoelectron peak intensity plotted on a semilog plot as a function of for MPTMS on Cu. (b) Dependence of photoelectron intensity, normalized with respect to Si  peak, on take-off angle . The lines joining the data points are guides for the eyes.

Image of FIG. 3.
FIG. 3.

(Color) Schematic sketch of formation process and structure: (a) Copper oxide reduction and monolayer formation, (b) bilayer formation; and (c) the structure of the MPTMS-based molecular bilayers on Cu. , , and denote propyl, methyl, and thiol or sulfonate groups, respectively.

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/content/aip/journal/apl/87/1/10.1063/1.1968414
2005-06-29
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Surface oxide reduction and bilayer molecular assembly of a thiol-terminated organosilane on Cu
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/1/10.1063/1.1968414
10.1063/1.1968414
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