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Surface oxide reduction and bilayer molecular assembly of a thiol-terminated organosilane on Cu
1.S. P. Murarka, Mater. Sci. Technol. 17, 749 (2001).
2.T. L. Alford, D. Adams, N. D. Theodore, T. Laursen, and M. J. Kim, Mater. Chem. Phys. 46, 248 (1996).
3.K. Barmak, A. Gungor, A. D. Rollett, Jr., C. Cabral, and J. M.E. Harper, Mater. Sci. Semicond. Process. 6, 175 (2003).
7.G. Ramanath, G. Cui, P. G. Ganesan, X. Guo, A. V. Ellis, M. Stukowski, K. Vijayamohanan, P. Doppelt, and M. Lane, Appl. Phys. Lett. 83, 383 (2003).
9.P. G. Ganesan and G. Ramanath, Twelfth International Workshop on the Physics of Semiconductor Devices, Chennai, India, 16–20 December 2003.
11.P. E. Laibinis and G. M. Whitesides, J. Am. Chem. Soc. 114, 9022 (1992).
12.F. Sinapi, L. Forget, J. Delhalle, and Z. Mekhalif, Appl. Surf. Sci. 212, 464 (2003).
17.Overlayer thickness evaluated using the expression where is the intensity, is a constant. For Cu photoelectrons, we use an attenuation length .
18.Theoretical intensities were calculated as a function of take-off angle for a four-molecule bilayer system. C–C, Si–O, and S–C bond lengths [obtained from
18.J. R. Colorado and T. R. Lee, J. Phys. Chem. B 107, 10216 (2003) and
18.CRC Handbook of Chemistry and Physcs, edited by D. R. Lide (CRC Press, Cleveland, OH, 2004)] were used to evaluate the distance of each atom from the Cu surface. By varying the ratio of the sulfur and sulfonated molecules, a best model structure was simulated.
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