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Measurements of dioxygen fluoride in an atmospheric pressure plasma jet
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10.1063/1.1968420
/content/aip/journal/apl/87/1/10.1063/1.1968420
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/1/10.1063/1.1968420
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(Top) Schematic of a coaxial-cylinder-type APPJ, which was designed for tantalum etching. (Bottom) Schematic of a parallel-plate-type APPJ, used for spatially resolved UV absorption spectroscopy.

Image of FIG. 2.
FIG. 2.

(a) Tantalum etch rates obtained as a function of collimator length. (b) Tantalum etch rates obtained as a function of substrate temperature.

Image of FIG. 3.
FIG. 3.

The dependence of and on distance and time operated at , , and gas temperature of .

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/content/aip/journal/apl/87/1/10.1063/1.1968420
2005-06-28
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Measurements of dioxygen fluoride (O2F) in an atmospheric pressure plasma jet
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/1/10.1063/1.1968420
10.1063/1.1968420
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