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High ductility of a metal film adherent on a polymer substrate
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10.1063/1.2108110
/content/aip/journal/apl/87/16/10.1063/1.2108110
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/16/10.1063/1.2108110
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Figures

Image of FIG. 1.
FIG. 1.

(Color online) The rupture of a metal film is caused by strain localization. Local thinning leads to local elongation. (a) A freestanding metal film accommodates the local elongation as the ruptured halves move apart. (b) When the film is well bonded to a substrate, the local elongation in the film may be suppressed by the substrate. (c) Debond of the metal film assists rupture.

Image of FIG. 2.
FIG. 2.

A -thick Cu film is well bonded to a polyimide substrate and is stretched to a strain of 10%. Except for isolated short cracks, the majority of the Cu film is intact.

Image of FIG. 3.
FIG. 3.

A -thick Cu film is poorly bonded to a polyimide substrate and is stretched to a strain of 6%. Channel cracks start to appear at strains about 2%. The density of the channel cracks increases with the applied strain. The Cu strips between adjacent channel cracks easily peel off, indicating the poor adhesion between the film and substrate.

Image of FIG. 4.
FIG. 4.

A -thick Cu film is well bonded to a polyimide substrate and is stretched to a strain of 30%. (a) Zigzag cracks appear in the Cu film. (b) Microcracks initiate at angles from the load direction, then coalesce to form the zigzag cracks. (c) Microcracks form by a mixture of local thinning and intergranular fracture.

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/content/aip/journal/apl/87/16/10.1063/1.2108110
2005-10-12
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: High ductility of a metal film adherent on a polymer substrate
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/16/10.1063/1.2108110
10.1063/1.2108110
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