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Grain boundary migration as rotational deformation mode in nanocrystalline materials
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10.1063/1.2147721
/content/aip/journal/apl/87/25/10.1063/1.2147721
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/25/10.1063/1.2147721
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Stress-induced migration of a low-angle (a, b) or high-angle (c, d) grain boundary (GB3) as a mechanism of rotational deformation realized through the glide of a wall of lattice dislocations (b) or motion of a dipole of wedge disclinations (d), respectively.

Image of FIG. 2.
FIG. 2.

The dependence of the energy gain on the migration distance for different values of the external shear stress shown at the curves in units of . The case of (a) relatively small and (b) relatively large .

Image of FIG. 3.
FIG. 3.

Correspondence between the equilibrium position of the migrating grain boundary and the external shear stress (solid curve on the left side from the intersection point ). The pointed-and-dashed curve is used to show the area (, ) where the correspondence between and is correct. The stress value is the highest stress level at which the grain boundary migration can be stable.

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/content/aip/journal/apl/87/25/10.1063/1.2147721
2005-12-14
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Grain boundary migration as rotational deformation mode in nanocrystalline materials
http://aip.metastore.ingenta.com/content/aip/journal/apl/87/25/10.1063/1.2147721
10.1063/1.2147721
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