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Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits
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10.1063/1.2161391
/content/aip/journal/apl/88/1/10.1063/1.2161391
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/1/10.1063/1.2161391
/content/aip/journal/apl/88/1/10.1063/1.2161391
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/content/aip/journal/apl/88/1/10.1063/1.2161391
2006-01-03
2014-08-30
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits
http://aip.metastore.ingenta.com/content/aip/journal/apl/88/1/10.1063/1.2161391
10.1063/1.2161391
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